Category Semiconductor Equipment | LED Equipment | Connector Equipment | LGP Equipment | Other

Auto Serration machine
1. Raw material : PC, MS, PMMA
2. LGP size: 60~360mm , [200~550mm}
3. LGP Thickness : 0.30~2.00mm
4. Tack time: 11 Sec(Base on 360mm)
5. Main feature : Dual working stage for serration
6. Foot print : L:1,900mm x W: 1,600mm x H: 2,060mm
INLINE SYSTEM (Serration-Auto Peel off-Roll Stamping)
1. Application LGP Size : 5~15.6¡° , [42"~86¡°]
2. Raw material : MS, PMMA
3. LGP Thickness : 0.2~1.5mm , [1.2~3.0mm]
4. Tack time : 7 Sec , [15sec]
5. Stock & Auto Loading System
6. Gross weight : 6Ton , [12ton]
196-43, Anyang-7 Dong, Manan-gu, Anyang-city, Gyeonggi-do, Korea. / TEL 031)459-3983 / FAX 031)459-3984
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